Surface Analysis Equipment - Physical Electronics, Inc.
  • Member Login
  • Register
  • NG Database Access
  • Home
  • Products
  • Techniques
  • Applications
  • About Us
  • Support
  • Contact

Products

  • Overview
  • Product Brochure
  • Die Navigation Module

Related Techniques

  • AES

Application Notes

  • Characterizing Electrically Isolated Bond Pad Surfaces
  • Characterizing Nano-Scale Precipitates in Steel
  • High Spatial Resolution Auger Imaging

View All

Contact PHI

PHI 700Xi Scanning Auger Nanoprobe

Application Notes

  • Characterizing Electrically Isolated Bond Pad Surfaces
  • Characterizing Nano-Scale Precipitates in Steel
  • High Spatial Resolution Auger Imaging
  • High Spatial Resolution Auger Imaging of Highly Topographic Samples
  • Fracture Analysis of an Embrittled Low Alloy Steel Rotor Blade from an Operating Steam Turbine
  • Auger Analysis of Boron Oxide Crystals Formed by CBN Chemical Vapor Deposition (CVD)
  • Using Low Energy Ions for Charge Neutralization in Scanning Auger Nanoprobes
  • Optimized Depth Resolution with Low Voltage Sputtering and Zalar Rotation
  • TiN Composition Measurements by Auger Electron Spectroscopy
  • Compucentric Zalar Profile of a 10 μm Al Pad Using the PHI 680 Scanning Auger Nanoprobe
  • Application for EBSD Option
  • Defect Navigation on Wafer Pieces with the PHI 700 Auger Nanoprobe

Privacy Policy Sitemap Member Login ULVAC-PHI, Inc.

Minneapolis Web Design Firm

© 2006 - 2012 Physical Electronics, Inc. All Rights Reserved.

18725 Lake Drive East, Chanhassen, MN 55317

Surface Analysis Instruments and Equipment

AVS Corporate Member