PHI SmartSoft

Die Navigation Module

PHI SmartSoft’s optional die navigation module uses fiducial marks and standard semiconductor defect files to confidently locate defects on wafer pieces for detailed Auger analysis. Protocols have also been developed to locate defects on unpatterned wafer pieces.

Fig. 1: Perform a three point alignment

Fig. 2: Navigate to the defect.

Fig. 3: Analyze the defect.