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Surface Analysis Spotlight - Surface Magnifying and identifying buried layers using in situ angle-lapped FIB and AES

Educational Series from our scientists

Characterizing thin, buried layers can often present a challenge despite the arsenal of state-of-the-art surface analytical techniques available today. One way to achieve nanometer scale chemical imaging of thin buried layers in situ is made possible by the introduction of focused ion beam (FIB) technology to modern UHV Auger electron spectroscopy (AES) systems. Learn about magnifying thin, buried layers via angle-lapped FIB cutting in latest spotlight.

Surface Magnifying and identifying buried layers using in situ angle-lapped FIB and AES

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© 2020 Physical Electronics, Inc. (PHI) All Rights Reserved.