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Microscopy & Microanalysis 2019

M&M 2019

Physical Electronics is happy to be exhibiting again at the 2019 Microscopy & Microanalysis Conference in Portland, Oregon.

Physical Electronics will be making several presentations throughout the week. Below is a list of those presentations:

Monday, August 5th - After Hours Vendor Tutorial - Ashley Ellsworth - Using AES, EDS, and FIB to Detect, Identify, and Image Buried Metallic Particles

Tuesday, August 6th - After Hours Vendor Tutorial - Bill StickleThe Complementary Nature of Surface Analysis Techniques (AES/XPS/TOF-SIMS) to Microscopy

Wednesday, August 7th, 11:45 AM, Room B113 - Gregory Fisher - Structural Assessment of (Sub-)Monolayer Coatings in Device Processing at High Spatial Resolving Power by TOF-SIMS Tandem MS Imaging​

As the event nears, more information will become available from PHI. Please visit the M&M website for more information about the event.