Article

Advancing Nanoscale Characterization: State-of-the-Art Applications of Auger Electron Spectroscopy

Surface Analysis Spotlight: AES

by Jennifer Mann Product Manager/Senior Staff Scientist

Auger Electron Spectroscopy (AES) is a highly effective analytical technique that provides quantitative elemental information from the top surface of solid materials. The average depth of analysis for an AES measurement is around 5 nm, with lateral spatial resolution as small as 8 nm. The information AES provides about surface layers or thin film structures is crucial for many industrial and research applications where surface or thin film composition plays a critical role in performance. These applications include nanomaterials, photovoltaics, catalysis, corrosion, adhesion, semiconductor devices and packaging, magnetic media, display technology, and thin film coatings used for various applications.

Recent developments in AES have dramatically expanded its capabilities in materials characterization, providing critical insights into surface composition, nanoscale chemical distributions, and depth information. In this presentation, we illustrate how state-of-the-art AES, performed on a PHI 710 integrated with complementary techniques such as Focused Ion Beam (FIB) milling and Energy Dispersive X-ray Spectroscopy (EDS), is redefining our ability to analyze complex, heterogeneous materials. We will demonstrate innovative applications across several challenging sample types and geometries.

For example, rapid elemental mapping has been achieved on complex samples such as lead-free solder and iron-containing nanoparticles. High-resolution AES mapping, combined with color overlays, enables clear visualization of distinct elemental distributions. Moreover, integration with FIB milling facilitates in situ cross-sectional analysis, revealing subsurface features that are inaccessible by standard surface techniques. This multimodal approach allows for both surface and sub-surface investigations, making it an invaluable tool in the analysis of advanced materials such as polished aluminum alloys and electrode materials in battery systems.

In summary, the combination of high spatial resolution, multi-technique integration, and automated analyses has positioned modern AES as an indispensable tool in materials science research. The PHI 710 exemplifies how a surface sensitive technique coupled with EDS and FIB can provide comprehensive insights into both surface and subsurface chemistries. This capability not only supports fundamental research but also accelerates the development of new materials and devices.

 

Fig. 1 A. 20 kV, 5 nA, SEM image of foil mixed Ag, Cu and Sn solder. B. 20 kV 5 nA, Auger elemental map of elemental distribution Sn (blue), Ag (red), and Cu (green).  Sample courtesy of Institute of Analytical Sciences and Physico-Chemistry for Environment and Materials (IPREM).

Fig 2. SEM images of FIB cut of highly topographical sample and Auger survey spectrum across FIB face. A. 20 kV, 5 nA, 100 µm field of view SEM image of FIB cut (indicated by the red box). B. 20 µm field of view SEM image of the FIB cut. C. 20 kV Auger survey of the FIB face.  The blue box indicates the area the electron beam is scanned over. Sample courtesy of Institute of Analytical Sciences and Physico-Chemistry for Environment and Materials (IPREM).

To discover the cutting-edge advancements in Auger Electron Spectroscopy and its transformative applications in materials science, attend the upcoming talk by Dr. Jennifer Mann "Advancing Nanoscale Characterization: State-of-the-Art Applications of Auger Electron Spectroscopy”.  Dr. Mann’s talk will take place on Tuesday July 29, 2025 at 10:30 am at the Microscopy and Microanalysis 2025 (M&M) conference in Salt Lake City, UT.