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The composition and thickness of surface species such as metal oxides play a critical role in the physical and electrical properties of metal interconnect structures such as solder bumps. Shown below is an XPS compositional depth profile of a solder bump surface obtained using a 20 µm x-ray beam for analysis.

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© 2020 Physical Electronics, Inc. (PHI) All Rights Reserved.
© 2020 Physical Electronics, Inc. (PHI) All Rights Reserved.