Surface Analysis


A Broad Range Of Surface Analysis Instruments

PHI manufactures a broad range of high performance surface analysis instruments to provide detailed surface chemical characterization, nano-scale feature analysis and thin film characterization. PHI’s innovative X-ray Photoelectron Spectroscopy ( XPS)Hard X-ray Photoelectron Spectroscopy (HAXPES), Auger Electron Spectroscopy (AES), and Time-of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS) technologies provide our customers with powerful tools to solve challenging materials problems and accelerate the development of new processes and products. As the only supplier that provides a full range of high performance XPS, HAXPES, AES, and SIMS instruments, PHI is in a unique position to provide complete surface analysis solutions for our customers.

Use the information in this section to learn more about various techniques and the PHI analysis equipment for each surface analysis technique.


X-ray photoelectron spectroscopy (XPS) surface analysis instruments provide elemental and chemical state information by measuring the binding energy of photoelectrons that have been excited with a mono-energetic x-ray beam. With the use of a sputter ion gun to remove material, thin film depth profile characterization is also possible.

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Hard X-ray Photoelectron Spectroscopy (HAXPES) instruments provide information similar to XPS – elemental and chemical state information – but from deeper depths. This opens opportunities for probing thicker film structures and buried interfaces, as well as minimizing the effects of surface contamination and ion-induced chemical damage during depth profiling.

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PHI's time-of-flight secondary ion mass spectrometry (TOF-SIMS) surface analysis equipment provides elemental, chemical and molecular information by measuring the mass of ions that have been ejected from a sample's surface with the use of a focused ion beam.

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Our Auger electron spectroscopy (AES) surface analysis equipment provides elemental and in some instances chemical information with the use of a finely focused electron beam to excite the Auger electrons. The analysis of submicron features is routine and thin film depth profile analysis is possible with the use of a sputter ion gun to remove material.

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Surface Analysis Spotlight

New educational series from our scientists. 

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© 2021 Physical Electronics, Inc. (PHI) All Rights Reserved.
© 2021 Physical Electronics, Inc. (PHI) All Rights Reserved.