Event
StrataPHI 3.0: Ultra-Thin Film Depth Profiling Redefined
Presented by Norb Biderman
New engineered materials demand new approaches as insights into ultra-thin films, surfaces, and interfaces are often obscured by the limitations of even traditional surface analysis techniques. StrataPHI 3.0 introduces an updated characterization platform designed for non-destructive, depth-resolved analysis of multi-layer films composed of ultra-thin layers.
StrataPHI leverages X-ray photoelectron spectroscopy (XPS) and hard X-ray photoelectron spectroscopy (HAXPES) data, extracting key processing-dependent material parameters, such as thickness and composition across multiple layers in a thin-film stack up to 30 nm below the surface.
The newest StrataPHI platform introduces an integrated analyzer acceptance angle mode that builds on the traditional model of a single photoelectron escape angle from the surface by including all escape angles as detected by the analyzer. This strengthens StrataPHI’s application in metrology, delivering rapid and reliable thickness measurement of individual layers in a multi-layer thin film, equivalent to thicknesses traditionally obtained via angle-resolved XPS.
StrataPHI also quantifies fractional coverage for individual layers, enabling detection of partial film formation and interface quality, such as partial Al2O3 coverage, critical for optimizing atomic layer deposition (ALD) and other processes.
This webinar will demonstrate how StrataPHI enables scientists and engineers to model complex ultra-thin film stacks and extract insights into new technologies. With automated batch analysis, StrataPHI also links processing conditions to thin-film properties, providing a comprehensive characterization suite for tighter control over performance and reliability of new materials and devices.
