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Coming Soon! StrataPHI 3.0: Next Generation Thin Film Intelligence

We are excited to announce the upcoming release of the latest version of our thin film structure analysis software, StrataPHI!  This release marks the next generation of PHI’s multi‑layer thin‑film analysis software for non‑destructive analysis from monolayer to 30 nm. Building on the proven capabilities of XPS and HAXPES, StrataPHI 3.0 enables rapid and precise film thickness analysis without the need for additional hardware or reference samples.

StrataPHI 3.0 transforms raw XPS and HAXPES data into actionable insight, by enabling precise film thickness and coverage analysis for structures ranging from single monolayers to 30 nm multilayer stacks—all without the need for specialized hardware or reference samples.

Built for Both R&D Agility and QC Reliability

StrataPHI 3.0 supports the full lifecycle of thin‑film development—from exploratory surface science to high‑volume manufacturing verification. Its combination of automation, precision, and ease of use makes it an essential tool for:

• Semiconductor and microelectronics labs
• Advanced coating development
• Battery and energy materials
• Failure analysis and reliability engineering

Powerful Thin‑Film Intelligence, Built for Modern Workflows

StrataPHI 3.0 builds on a proven foundation while introducing several significant new capabilities that streamline analysis and enhance user experience.

✔ Non‑Destructive Thin‑Film Characterization

• Measure film thicknesses from monolayer to 30 nm directly from XPS/HAXPES data.
• No additional instrumentation modifications or external reference samples needed.

✔ Updated User Interface for Greater Insight (New!)

• The redesigned interface features colorized depth profiles that make it easier than ever to visualize complex multi‑layer structures and quickly interpret results.

✔ Integrated Analyzer Acceptance Angle Mode (New!)

• Our new acceptance‑angle integration mode simulates the full angular range of emitted electrons—bringing the model and thickness measurement closer to the physical process.
• The result: faster workflows and improved thickness precision.

✔ RSF Optimization Mode (New!)

• Enhances accuracy of XPS thickness measurements by calibrating RSF against samples with known thicknesses, ensuring reliable thickness measurements across R&D, metrology, and multiple analytical techniques.

✔ Automated, Real‑Time Batch Processing

• StrataPHI 3.0 delivers automation that scales.
• Run multiple measurements automatically for high‑volume metrology, accelerating both R&D iterations and QC throughput.

✔ Smart Data Management with SPR Files

• Every optimized model can be saved as a StrataPHI Process Record (SPR) file, making analysis repeatable, consistent, and easily transferable across teams or projects.

✔ Seamless Export to Common Formats

Whether preparing reports, presentations, or data reviews, StrataPHI 3.0 exports smoothly into:

• Microsoft Excel™
• PowerPoint™
• Standard text formats

✔ Accurate Analysis of Fractional Coverage

For ultra‑thin layers such as monolayers, StrataPHI 3.0 supports simultaneous measurement of fractional coverage and thickness, offering a unique capability validated against techniques like:

• Optical microscopy
• Low‑energy ion scattering (LEIS)

This dual‑parameter analysis helps researchers capture subtle growth behaviors, contamination levels, or early‑stage film formation that traditional tools often miss.

No matter the application, StrataPHI 3.0 accelerates discovery and strengthens decision‑making.