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Introducing StrataPHI 3.0 - Faster, Smarter, More Accurate Thin‑Film Insights

Advances in materials science continue to push the boundaries of what’s possible in semiconductor research, coatings, surface engineering, and nanoscale device development. As thin‑film structures become increasingly complex and functional, the need for fast, reliable, and non‑destructive characterization tools has never been greater.

Today, we’re excited to introduce StrataPHI 3.0—our latest generation of ultra‑thin film analysis software designed to deliver unmatched clarity, automation, and accuracy for researchers and quality‑control teams alike.

The latest version introduces an updated user interface with an improved single window, tabbed view and features colorized depth profiles.  A new model to more effectively capture the true physics of the photoemission process has been added, Integrated Analyzer Acceptance Angle mode.  This model is an improvement over the previous single escape angle mode and provides a more realistic simulation of the true photoelectron escape process, which occurs over multiple angles.  Using the Integrated Analyzer Acceptance Angle mode, allows for precise measurements across the full angular range of electrons.  

For greater accuracy of thickness measurements, relative sensitivity factor (RSF) optimization has been introduced.  By taking thickness measurements from another technique, such as TEM, the RSF can be optimized for a particular layer to match those results.  Once the RSF is optimized, it can be applied to analyze the same film stacks for research and development and metrology purposes, resulting in accurate, consistent thickness measurements across multiple analytical techniques.

StrataPHI 3.0 continues to streamline scientists’ workflows with automated, real-time batch processing and seamless export options.  Newly added, file load controls are now available to easily find any previously analyzed file without needing to remember the file location.  Automated, real-time batch processing tools are available enabling fast calculation of thickness of ultra-thin layer for metrology.

With automated, real-time batch processing and seamless export options, StrataPHI 3.0 empowers scientists to simultaneously determine fractional coverage and thickness of ultra-thin layers, ensuring results consistent with optical microscopy and Low Energy Ion Scattering (LEIS).

This release marks a significant step forward in thin film metrology, streamlining workflows and enhancing analytical precision for advanced materials research.